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Multi-Mix® FAQ

1)  What type of interfaces are available for Multi-Mix®?

2)  What quality testing has Multi-Mix® been subjected to?

3)  How does the Multi-Mix® process deal with the issue of hermeticity?

4)  What is the coefficient of thermal expansion for the substrate materials used in Multi-Mix® technology?

5)  How does the Multi-Mix® process dissipate unwanted heat?

6)  What are the advantages of the process?

7)  What are the limitations of the Multi-Mix® process in the area of:

8)  What type of resistors are used in the Multi-Mix® process?

1)  What type of interfaces are available for Multi-Mix®?

  • Surface mount
    • Suitable for pick-and-place assembly
    • Compatible with microstrip or coplanar waveguide
  • Coplanar waveguide
    • Frequencies through Ka Band
    • Gold, ribbon bond surfaces

2)  What quality testing has Multi-Mix® been subjected to?

  • Thermal cycling life test: 1000 plus cycles -65 to +125 degrees C
  • Themal Shock, Burn-In, Acceleration, Vibration, Mechanical Shock, Moisture Resistance, Solder Heat

3)  How does the Multi-Mix® process deal with the issue of hermeticity?

  • Substrate materials are hydrophobic, repelling moisture and high surface tension liquids.
  • Substrate materials absorb low tension liquids.
  • Hermetically packaged MMIC's are embedded within the multilayer module.
  • Non-hermetic MMIC's, embedded within the multilayer module, have passed rigorous screening (above).
  • Dielectrics
    • (Er=2.94) moisture absorption = 0.1%
    • (Er=3.00) moisture absorption = 0.1%
    • (Er=6.15) moisture absorption = 0.1%
    • (Er=10.2) moisture absorption = 0.1%
    • (Er=3.38) moisture absorption = 0.06%
    • (Er=4.50) moisture absorption = 0.01%

4)  What is the coefficient of thermal expansion for the substrate materials used in Multi-Mix® technology?

  • Dielectric CTE well matched to metal CTE
  • Copper: CTE= 17 ppm/degrees C
  • Aluminum: CTE= 24 ppm/degrees C
  • Dielectrics
    • (Er=2.94) CTE(x,y) = 16 ppm/degrees CCTE(z)= 24 ppm/degrees C
    • (Er=3.00) CTE(x,y) = 17 ppm/degrees CCTE(z)= 24 ppm/degrees C
    • (Er=6.15) CTE(x,y) = 17 ppm/degrees CCTE(z)= 24 ppm/degrees C
    • (Er=10.2) CTE(x,y) = 17 ppm/degrees CCTE(z)= 24 ppm/degrees C
    • (Er=3.38) CTE(x,y) = 11,14 ppm/degrees CCTE(z)= 35 ppm/degrees C
    • (Er=4.50) CTE(x,y) = 14 ppm/degrees CCTE(z)= 20 ppm/degrees C

5)  How does the Multi-Mix® process dissipate unwanted heat? 

  • Thermal vias conduct heat away from active devices
  • Thermal vias achieve thermal resistance < 1 degree C / Watt

6)  What are the advantages of the process?

  • Homogeneous dielectric provides superior microwave properties (loss tangent, dispersion)
  • Allows greater complexity of buried vias for interconnections

7)  What are the limitations of the Multi-Mix® process in the area of:

A.  Thickness?

  • There is no practical limitation on thickness or on the number of layers
  • Have manufactured MMFM's with 52 layers

B.  Size?

  • Can typically process, but are not limited to 18 x 24 inch panels
  • Have the ability to form larger multilayer panels using the fusion bonding process

C.   Frequency (upper and lower limit)?

  • Microwave through Millimeter wave

D.  Air Gaps?

  • There are no unwanted air gaps in a fusion bonded multilayer
  • Have the ability to form cavities within the multilayer
  • Have the ability to utilize an air dielectric constant within the multilayer

8)  What type of resistors are used in the Multi-Mix® process?

  • Metal film resistors are etched as are copper circuit patterns
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